3D Semiconductor Device Integration, Design and Development

rti international, wafer and die bonding, wafer and die bonding technology, integrated circuits, semiconductors, semiconductor design, semiconductor manufacturing, high-speed logic, mems, direct bond interconnect, dbi technology, silicon bonding, 3d bonding, 3d routing, 3d integrated circuits, 3d ics, 3d circuit technology, true 3d integration

ziptronix is an advanced semiconductor process development firm creating next-generation semiconductor integration strategies and processes to advance the fabrication of mems, high-speed logic, rf devices and enable the construction of true 3-d semiconductor devices.