ellipsometer, ellipsometry, thin film metrology, thin film measurement, thickness measurement, spectroscopic ellipsometry, spectroscopic ellipsometer, reflectometer, thin film analysis, refractive index, optical measurement,plasma etch,plasma etcher,reactive ion etch,reactive ion etcher,plasma deposition,pecvd,plasma enhanced chemical vapor deposition, icp etch,icp etcher,inductively coupled plasma etcher,icp pecvd,photoresist stripping,photoresist stripper,resist stripper,rapid thermal processor,rapid thermal anneal,rapid thermal annealing,plasma wafer backside thinning,diode etcher,asher,x-ray fluoresence,lpcvd,rtcvd,mocvd,semiconductor process equipment,compound semiconductor process equipment,sic furnace,sic deposition,low damage etcher,low damage deposition,uvrtp, defect inspection, xrf, dry chemical plasma etcher, polymide etching, silicon oxide deposition, gate dialectric modification, combined edge & back side defect inspection, rie, drie, cvd, defect analysis, solar substrate,

axic, inc manufactures and distributes semiconductor plasma processing equipment and thin film metrology tools (ellipsometer, spectroscopic and discrete wavelength ellipsometry, film thickness probe, reflectometer) for the semiconductor, iii-v compound semiconductor, optics, photonics, optoelectronics, nanotechnology and micro electromechanical system (mems) industries. we offers six product lines including: 1. plasma processing equipment for inductively coupled plasma (icp) etch, low temperature plasma enhanced chemical vapor deposition (icp pecvd), reactive ion etch (rie), pecvd for fabrication of silicon and iii-v (gaas, gan and inp) devices for microprocessors, vcsel, hbt and laser diodes. 2. etchers for photoresist stripping, surface cleaning and modification and hybride cleaning. 3. microwave plasma etcher for wafer thinning and damage removal. 4. rapid thermal processors for annealing (rta), oxidation (rto), nitridation (rtn), chemical vapor deposition (rtcvd), metal organic chemical vapor deposition (mocvd), low k and high k materials densification (uv-rtp), low pressure chemical vapor deposition (lpcvd) and sic annealing and deposition. 5. metrology tools such as spectral ellipsometer/reflectometers, optical thin film analyzer and x-ray fluorescene (xrf) for thin film thickness, refractive index, absorption and composition characterization. 6. used semiconductor process equipment for e-beam evaporation, ion milling, etch, deposition, sputter deposition, and others.