dicing,dising,wafer,scribing,semiconductor,ceramic,sapphire,micromachining,optical,dicing,wafer,waffer,circuit,substrate,micro,hybrid,dicing,wafer,prototype,electro-optical,alumina,quartz,pcb,dicing,wafer,sawing,saw,custom,dicing,wafer,cutting,pzt,fiber,optic,dicing,wafer,ceramic,sapphire,scribing,prototype,alumina,quartz,pcb,sawing,saw,custom,cutting,pzt,fiber,optic,sawing

provides quick turn precision wafer dicing of hard brittle materials. customers include telecommunications, biotech, medical, optical, the semiconductor industry, and many others.