Turnkey/Consignment/Box-build for SMT/Thru-hole. Other services include backplane board size (20x24), 0402 component size, 15 mil fine pitch IC, cable assembly, testability review, in-house test fixture and programming, BGA rework, X-ray reliability

Dual Fuji high-speed automatic SMT, Mydata Hydra TP & MY series SMT, Heller 1800 Reflow Oven, Nu Era wave solder, AquaKlean deionized water system, Glenbrook BGA X-Ray, AOI, Metcal BGA rework station GenRad ICT testers, Checksum test eq., Cable Scan eq.

prototype services, prototyping surface mount,smt,through-hole assembly,printed circuit assembly,full system assembly,mechanical box build,mechanical assembly,aoi,automated optical inspection,x-ray inspection,turn-key consignment contract manufacturing,offshore outsourcing,contract electronics manufacturing services,fine pitch to 12 mils,ball grid array,bga,micro bga,bga remove, reball & repair,in-circuit testing,ict genrad,mda testing,functional testing,test fixture & programming,boundary scan,testability,manufacturability,cable and harness assembly,cable testing,high-reliability printed circuit boards,certified iso 9001-2000,ipc-a-610 certified assembly,qs 9000 compliance

ect offers consignment and turnkey project solution services. we will customary address testability, material savings, and manufacturability issues to assist our customers. our extensive manufacturing experiences and consistent processes enable us to reinforce high standards at every stage of production. our ultimate objective is to offer a wide range of services and to deliver quality products with total yield outcome to fulfill our customers’ go-to-market needs.