Contractor Directory > GRINDING & DICING SERVICES, INC.
GRINDING & DICING SERVICES, INC.San Jose, California
408-451-2000 x120
925 Berryessa Rd
San Jose, CA 95133-1002
Fax:408-451-2001
Products & Services
GDSI provides wafer grinding and dicing to large and small integrated circuit manufacturers as well as fabless companies. GDSIs service offerings include backgrinding, dicing and saw, pick and place, automated inspection, and wafer polishing.
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Keywords
- Grinding
- Dicing
- Semiconductortapes
NAICS Code(s)
- 334413
- Semiconductor and Related Device Manufacturing
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Company Information
- Company Name:
- GRINDING & DICING SERVICES, INC.
- Address:
- 925 Berryessa Rd
- City:
- San Jose
- State:
- California
- Zip Code:
- 95133-1002
- Phone:
- 408-451-2000 x120
- Fax:
- 408-451-2001
- Contact Person:
- JOE COLLINS
- Contact Title:
- Sales Manager
- Legal Structure:
- Subchapter S Corporation
- Year Established:
- 1992
- Ownership:
- Asian Pacific American
- Other Minority Owned
- Woman Owned
See Also
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SILICON QUEST INTERNATIONAL, INC San Jose, Ca
Silicon Quest International, Inc. is a first-rate supplier of silicon wafers, semiconductor materials and wafer processing services. Our mission is